AutoNet 2008

The 3rd IEEE Workshop on Automotive Networking and Applications

(AutoNet 2008)



Co-located with IEEE GLOBECOM 2008

December 4, 2008 (Thursday) New Orleans, LA, USA



Coupled with advances in wireless communications and computing technologies, there have been significant recent efforts to enhance and integrate the communications and computing technologies into the vehicle and transportation systems to enhance vehicle safety, reduce traffic congestion, and protect environment. Significant industrial and governmental efforts are underway to push for vehicle-to-vehicle / vehicle-to-infrastructure networking functions in vehicles and highway infrastructure. When such communications and networking capabilities are integrated into vehicles and the infrastructure, not only safety but many other emerging applications can be supported for intelligent interactions with the transportation system, with other vehicles, and inside vehicles, to help with traffic management, vehicle diagnostics, mobile commerce, and much more.



This one-day workshop intends to bring together researchers, professionals, and practitioners to discuss and address recent developments and challenges in deploying vehicle-to-vehicle / vehicle-to-infrastructure networking technologies and their applications.



Specifically, we solicit original research contributions addressing the following areas:



* Vehicle-to-vehicle (V2V) communications

* Vehicle-to-infrastructure (V2I) communications

* Vehicular ad hoc networks

* Potential applications of V2V and V2I communications including ITS

* Protocols for V2V and V2I communications (MAC, routing, mobility
management, etc.)

* Security and privacy issues in V2V and V2I networks

* Physical layer and RF level technologies for V2V and V2I communications

* Antenna technologies for V2V and V2I communications

* Radio resource management and QoS support for V2V and V2I communications

* Information networking over V2V, V2R and next-generation networks

* Simulation / performance evaluation techniques for V2V and V2I
communications

* Algorithms, protocols and systems for data dissemination in V2V and V2I
communications

* Experimental systems and testbeds for V2V and V2I communications

* Standardization updates on V2V and V2I communications



All submitted papers will be peer-reviewed. Accepted papers will appear in
the Workshop proceedings (CD-ROM and booklet of papers) as well as on the
IEEE Xplore.

Workshop URLs: http://www.ieee-globecom.org/ (workshops) or

http://autonet2008.research.telcordia.com/

EDAS URL: http://edas.info/newPaper.php?c=5783&track=4681



Submission Instructions
Authors are invited to submit full papers of up to 20 double-spaced pages,
including references, figures and tables. All submissions should be
submitted electronically in
Postscript or Adobe PDF format on EDAS
http://edas.info/newPaper.php?c=5783&track=4681



Please direct questions regarding the submission procedure to:

Wai Chen (wchen@research.telcordia.com)

Onur Altintas (onur@jp.toyota-itc.com)


Important Dates:

Paper Submission Deadline:

September 1, 2008


Notification of Acceptance:
October 1, 2008

Camera-Ready Submissions:
October 15, 2008





Workshop Co-chairs
Dr. Wai Chen, Telcordia Technologies, USA
Dr. Onur Altintas, Toyota InfoTechnology Center, Japan


Program Advisor
Prof. Tadao Saito
Professor Emeritus, University of Tokyo, Japan

CTO, Toyota InfoTechnology Center, Japan

Technical Program Committee

Subir Biswas

Michigan State University, USA



Fan Bai

GM R&D Center, USA



Luca Delgrossi

Mercedes-Benz Research Lab, USA



Eylem Ekici

Ohio State University, USA



Andreas Festag

NEC Lab, Germany



Marco Gruteser

WINLAB, Rutgers University, USA



Ratul Guha

Telcordia Technologies, USA



Jerome Harri

University of Karlsruhe, Germany



Teruo Higashino

Osaka University, Japan



Hariharan Krishnan

GM R&D Center, USA



Tim Leinmuller

Denso Automotive Deutschland GmbH, Germany



Thomas Luckenbach

FOKUS, Germany



Michela Meo

Politecnico di Torino, Italy



Rahul Mangharam

University of Pennsylvania, USA



Nick Maxemchuk

Columbia University, USA



Guevara Noubir

Northeastern University, USA



Umit Ozguner

Ohio State University, USA



Ai-Chun Pang

National Taiwan University, Taiwan



Chirag Patel

Qualcomm, USA



Panagiotis Papadimitratos

EPFL, Switzerland


Daniel Stancil

Carnegie Mellon University, USA



Chien-Chung Shen

University of Delaware, USA



Marcus Strassberger

BMW Group, Germany



Kazunori Takeuchi

KDDI R&D Lab, Japan



Kemal Tepe

University of Windsor, Canada



Christian Wewetzer

Volkswagen Group, Germany



Benjamin Weyl

BMW Group, Germany



Richard Wolff

Montana State University, USA



Daniel Wong

Malaysia University of Science and Technology, Malaysia